What it is

HRL announces Low-Chill single-phase direct liquid cooling for data centers, demonstrating 8.2°C/kW thermal resistance, <1 psi pressure drop, and pump power <1% of rack IT load. Technology supports up to 3kW per 750mm² die, 400W/cm² heat flux, and coolant inlet temperatures up to 70°C, targeting NVIDIA Rubin/Feynman GPUs.

Why it matters

By enabling 70°C coolant inlet temperatures and sub-1% pumping power, this technology allows facilities teams to use dry air coolers instead of evaporative systems and reduce auxiliary mechanical load. This shifts data center design constraints in water-scarce regions and reduces balance-of-plant electrical capacity for cooling infrastructure supporting next-gen AI workloads.

Evidence from source:

  • Thermal interface resistance of 8.2°C/kW, pressure drop below 1 psi per block, pumping power <1% of rack IT power
  • Supports coolant inlet temperatures up to 70°C, enabling dry air coolers instead of evaporative systems
  • Cooling of up to 3 kW for a single 750mm² die, heat fluxes up to 400W/cm², targeting NVIDIA Rubin and Feynman GPUs

Open questions

  • What are the manifold/block footprint and plumbing interface requirements compared to existing cold-plate standards?
  • How does the 3D-printed manifold affect field serviceability, lead times, and spares inventory strategy?